传OpenAI自研AI芯片,将由台积电代工并搭载3nm技术,意在摆脱英伟达依赖

DeepTech深科技
11 Feb

当地时间 2 月 10 日,据路透社报道 OpenAI 正在开发其第一代内部 AI 芯片。消息人士表示,OpenAI 将在未来几个月内完成其首款内部芯片的设计,并计划将其送往 台积电 制造,台积电将使用 3nm 技术制造 OpenAI 芯片,该芯片有望在 2025 年底进行测试以及在 2026 年开始大规模生产,预计该芯片将具有“高带宽内存”和“广泛的网络功能”。同时,OpenAI 预计将在“有限...

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