2月11日消息,据外媒报道,在芯片制程工艺上走在行业前列,为苹果、英伟达、AMD等厂商代工晶圆的台积电,2020年5月15日就已宣布在美国亚利桑那州投资建厂,最初计划是建设一座采用5nm制程工艺量产晶圆的工厂,但在2020年12月6日宣布建设第二座工厂时,第一座晶圆厂的制程工艺由5nm提升到了4nm,第二座晶圆厂则是计划建成之后用于3nm制程的量产。而从外媒最新的报道来看,除了在建设的4nm和...
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