(信息来源:爱集微)根据市场调查及研究机构Counterpoint Research的最新报告显示,2024年全球晶圆代工市场以22%的年增长率结束,展现出2023年之后的强劲复苏与扩张动能。报告表示,此增长主要来自于先进制程需求的激增,受AI应用加速导入数据中心与边缘计算所驱动。而晶圆代工领头羊台积电则凭借5/4nm与3nm先进制程的强劲需求,抓住市场机会,加上CoWoS等先进封装技术的发展,也...
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