金融界2025 年 2 月 13 日消息，国家知识产权局信息显示，意法半导体国际公司申请一项名为“集成基于异质结构的电子组件并具有降低的机械应力的半导体电子装置”的专利，公开号 CN 119403214 A，申请日期为 2024 年 7 月。
专利摘要显示，本公开涉及集成基于异质结构的电子组件并具有降低的机械应力的半导体电子装置。一种半导体电子装置具有半导体材料的基板区域；基于异质结构的第一电子组件，其具有在基板区域上延伸并包括异质结构的外延多层；以及在基板区域上延伸的分隔区域。分隔区域包括沿着第一方向布置在外延多层旁边的多晶类型的半导体材料的多晶区域。电子装置还具有在基板区域上延伸的单晶类型的单半导体材料的外延区域多晶区域沿着第一方向在外延多层与外延区域之间延伸。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.