【三星计划2028年推出“移动HBM”】金十数据2月19日讯，三星电子半导体暨装置解决方案（DS）部门首席技术官宋在赫表示，搭载LPW DRAM内存的首款移动产品将在2028年上市。LPW DRAM通过堆叠LPDDR DRAM，大幅增加I/O接口，可减少耗电量并提高性能，采用垂直引线键合的新封装技术，被誉为“移动HBM”。其带宽可达200GB/s以上，较现有的LPDDR5x提升166%。
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