三星计划2028年推出“移动HBM”

美港电讯
19 Feb

【三星计划2028年推出“移动HBM”】金十数据2月19日讯,三星电子半导体暨装置解决方案(DS)部门首席技术官宋在赫表示,搭载LPW DRAM内存的首款移动产品将在2028年上市。LPW DRAM通过堆叠LPDDR DRAM,大幅增加I/O接口,可减少耗电量并提高性能,采用垂直引线键合的新封装技术,被誉为“移动HBM”。其带宽可达200GB/s以上,较现有的LPDDR5x提升166%。

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