日月光半导体(ASX)盘前升逾2% 集团投资3亿美元马来西亚封测新厂启用

金吾财讯
18 Feb

金吾财讯 | 日月光半导体(ASX)盘前股价上行,暂升2.02%,报11.1美元。

消息面上,日月光投控旗下日月光半导体18日上午于马来西亚槟城举行第四厂及第五厂厂启用典礼,借以扩大在车用半导体及生成式人工智能(GenAI)快速成长的需求,投资总额高达3亿美元,预计未来几年将为当地创造1500名就业机会。

其马来西亚分公司总经理李贵文表示,此工厂是策略扩张计划的一环,日月光马来西亚厂区由目前100万平方英尺,将扩大至约340万平方英尺。

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