【龙芯中科：下一代服务器芯片3C6000系列目前处于样片阶段 预计今年Q2完成产品化并正式发布】金十数据2月17日讯，龙芯中科公告称，公司在投资者关系活动记录表表示，定位终端应用的2K3000/3B6000M已回片测试中；下一代桌面芯片3B6600处于设计阶段；服务器芯片3C6000系列预计今年Q2完成产品化并正式发布；GPGPU芯片9A1000预计今年上半年流片。此外，公司在工控领域推出了多款SoC和MCU芯片，广泛应用于能源、交通、教育等领域。对于2024年的营收和毛利率，公司预计营业收入与去年持平，毛利率小幅下降。未来，公司将继续实施“稳员增效”的方针，并根据市场需求逐步考虑人员扩张。
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