台积电先进封装业务爆单 传英伟达独占七成

联合早报
24 Feb

全球最大芯片制造商台积电先进封装业务爆单,据报其中七成都由美国芯片龙头英伟达包下。 英伟达将于2月26日美股盘后发布上季度财报与下季度展望。分析认为,英伟达大举包下台积电先进封装产能,意味今年旗下AI芯片出货持续放量,四大云端服务供应商(CSP)拉货动能续强,为财报会议提前报喜。 台积电未针对上述传闻做出回应,但集团董事长兼总裁魏哲家在上月的法人说明会上指出,人工智能(AI)芯片先进封装需求持续...

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