台积电今年超70%先进封装产能被英伟达包下

芯智讯
24 Feb

2月24日消息,据台媒《经济日报》报道称,近日业界传出消息,英伟达(NVIDIA)最新Blackwell构架GPU芯片需求强劲,已包下台积电今年超过70%的CoWoS-L先进封装产能,出货量以每季环比增长20%以上逐季冲高,助力台积电营运热转。业界分析称,英伟达将于26日美股盘后发布上季财报与展望,随英伟达大举包下台积电先进封装产能,意味今年旗下AI芯片出货持续放量,四大云端服务供应商(CSP)...

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