苹果C1基带芯片
凤凰网科技讯 北京时间2月24日,据科技博客9to5mac报道,彭博社知名苹果记者马克·古尔曼(Mark Gurman)周日发文称,苹果未来最终将会把基带芯片集成到主处理器中,最快2028年实现。
古尔曼同时曝光了未来两代苹果基带的推出时间。他表示,苹果对其自研基带进行了长远规划。除了已经发布的C1,苹果已经在测试C2和C3基带。C2预计将在2026年推出,将登陆更高端的iPhone机型。接着就是C3,它将在2027年发布。苹果希望C3在性能上能够超越高通基带。
在基带性能上完成对高通的超越后,苹果打算把基带集成到主处理器中,合二为一,这样不仅节能,还能降低成本。不过,这一过程需要花费至少三年时间,最快也要等到2028年。(作者/箫雨)
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