金吾财讯 | 英特尔(INTC)宣布阿斯麦(ASML)首批高数值孔径光刻机已投入量产,单季度产出3万片晶圆(每片可切割数千芯片)。该设备可靠性较前代翻倍,仅需一次曝光及个位数步骤即可完成传统工艺三次曝光、40步的操作,显著提升效率。公司正利用该技术推进18A制程(2024年底量产),并规划用于下一代14A制程,此举扭转了此前在极紫外光刻技术应用中的落后局面,重获半导体制造竞争力。
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