【SK海力士韩国龙仁半导体集群一期晶圆厂动工 预计2027年竣工】SK海力士2月25日发布消息称,韩国京畿道龙仁半导体集群内的SK海力士一期晶圆厂于昨日正式破土动工。SK海力士去年7月通过董事会决议,决定投资约9.4万亿韩元(约合66亿美元)建设龙仁半导体集群一期晶圆厂及相关办公设施。SK海力士计划在龙仁集群内分阶段建设四座晶圆厂,一期工厂预计2027年5月竣工。该工厂建成后将成为高带宽存储器(HBM)等新一代DRAM存储芯片生产基地。(科创板日报)

金融界
25 Feb
SK海力士2月25日发布消息称,韩国京畿道龙仁半导体集群内的SK海力士一期晶圆厂于昨日正式破土动工。SK海力士去年7月通过董事会决议,决定投资约9.4万亿韩元(约合66亿美元)建设龙仁半导体集群一期晶圆厂及相关办公设施。SK海力士计划在龙仁集群内分阶段建设四座晶圆厂,一期工厂预计2027年5月竣工。该工厂建成后将成为高带宽存储器(HBM)等新一代DRAM存储芯片生产基地。(科创板日报)

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