摩通发表报告指，ASMPT(00522.HK) 上财季财报表现与过去几季类似，主流封装收入和表面贴装技术(SMT)业务的疲软持续拖累利润率。但公司对热压键合(TCB)业务仍保持乐观，称其总可服务市场将实现45%的年复合增长率，并有望在2024至2027年间实现4倍的收入成长。这应会推动先进封装业务的持续增长，预计到2027年，可能占总收入的45%至50%。
该行预计ASMPT短期内股价将保持波动，但TCB和其他先进封装领域的强劲进展令人鼓舞。维持“增持”评级，目标价由115元降至90元。(ha/da)(港股报价延迟最少十五分钟。沽空资料截至 2025-02-26 16:25。)
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