马来西亚首相安华:Arm即将于本周签署在马建设基地协议

IT之家
03 Mar

IT之家 3 月 3 日消息,据马来西亚国家新闻社 BERNAMA 报道,该国首相安华(也译为安瓦尔)当地时间 2 月 28 日表示其于同日与 Arm 首席执行官雷内・哈斯(Rene Haas)进行了在线会谈,Arm 母公司软银首席执行官孙正义同样参会。

安华称马来西亚政府与 Arm 双方将在本周敲定并签署一项基地建设协议。他表示国际芯片设计巨头的投资也是对该国专业半导体人才储备的一项挑战。

马来西亚在 2024 年公布了该国半导体战略,政府计划提供 250 亿令吉 / 林吉特(IT之家备注:当前约 408 亿元人民币)的财政支持,并为 6 万半导体工程师提供培训。

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