1000亿美元,台积电将建3座新晶圆厂+2座先进封装设施

全球半导体观察
04 Mar

3月4日,台积电宣布有意增加1000亿美元(当前约7288.74亿元人民币)投资于美国先进半导体制造。这笔资金将用于在美兴建3座新晶圆厂、2座先进封装设施,以及1间主要研发团队中心。据悉,台积电此前在美建设项目仅包括晶圆厂和设计服务中心,此次新投资补充了配套的先进后端制造能力。台积电董事长兼总裁魏哲家表示,我们拟增加1000亿美元投资于美国半导体制造,这让我们的计划投资总额达到1650亿美元。结合...

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