3月7日的消息显示,知名分析师郭明𫓹透露了苹果自研基带芯片的最新进展。据悉,苹果计划于明年量产一款支持毫米波技术的升级版C1基带芯片,这将弥补其在5G通信领域的最后一项短板。郭明𫓹指出,尽管支持毫米波技术对苹果而言并非难以实现的目标,但如何在保证连接稳定性的同时实现低功耗,仍然是一个不小的挑战。此外,与处理器不同,基带芯片的研发并不需要采用最先进的工艺制程,因为这方面的投资回报率相对较低。因此,...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.