IT之家 3 月 10 日消息,据外媒 Business Korea 报道,三星设备解决方案(DS)部门已开始了下一代玻璃基板封装材料“玻璃中介层”开发,目标旨在替代昂贵的传统有机塑料封装基板,同时提升性能,相应材料计划在 2027 年实现量产。三星计划利用康宁提供的玻璃材料开发相应“玻璃中介层”,同时会将部分封装材料生产项目外包给 Chemtronics 和 Philoptics 公司完成。与...
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