随着人工智能(AI)和高性能计算(HPC)的快速发展,对更快的数据中心互连的需求日益增长,光互连成为了解决电子输入/输出(I/O)性能扩展的一种可行性解决方案。利用硅材料制造光电子器件,既能结合硅材料在成熟制造工艺、低成本和高集成度等优势,又能发挥光子学在高速传输与高带宽等方面的优点。据TrendForce报道,三星联手博通(Broadcom),推进硅光子技术的开发,预计未来两年内推出这项技术。...
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