路透阿姆斯特丹3月19日 - 计算机芯片制造商和半导体供应链公司周三呼吁欧盟执委会启动一项新的支持计划，作为《2023年芯片法案》的后续计划，此次除了关注芯片制造外，还重点关注芯片设计、材料和设备。
在与布鲁塞尔的行业顶级公司和欧洲立法者会面后，代表芯片制造商的行业组织ESIA和代表更广泛行业的SEMI欧洲表示，他们将向欧盟执委会数字事务负责人Henna Virkkunen发出呼吁，要求制定“芯片法案2.0”。
(为便利非英文母语者，路透将其报导自动化翻译为数种其他语言。由于自动化翻译可能有误，或未能包含所需语境，路透不保证自动化翻译文本的准确性，仅是为了便利读者而提供自动化翻译。对于因为使用自动化翻译功能而造成的任何损害或损失，路透不承担任何责任。)
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