苹果A20芯片预计将沿用台积电N3P工艺

美港电讯
19 Mar

【苹果A20芯片预计将沿用台积电N3P工艺】金十数据3月19日讯,苹果预计将沿用台积电N3P工艺制造A20芯片,推迟采用2nm工艺,但将采用CoWoS封装。该芯片预计将于2026年底与iPhone 18系列同时亮相。

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