【英伟达宣布下一代超级芯片Vera Rubin】金十数据3月19日讯，英伟达(NVDA.O)CEO黄仁勋在GTC大会上向世界展示了其下一代Vera Rubin AI超级芯片和Blackwell Ultra。他表示，今年下半年将过渡至Blackwell Ultra芯片，Vera Rubin将在2026年下半年开始出货时接替Blackwell Ultra芯片。Vera Rubin和Grace Blackwell类似，集成了CPU和GPU。在Grace Blackwell中，Grace是CPU，Blackwell是GPU；而在Vera Rubin中，Vera是CPU，Rubin是GPU。英伟达表示，Vera CPU的内存是Grace的4.2倍，内存带宽是Grace的2.4倍。结合Vera的88个CPU内核，英伟达称该芯片的整体性能将是前一代产品的两倍。Rubin GPU则将配备288GB的HBM4。不仅如此，英伟达还宣布了Vera Rubin之后的一代芯片，名为Vera Rubin Ultra。将于2027年下半年上市的Vera Rubin Ultra将把Vera CPU和Rubin Ultra芯片结合在一起。每个Rubin处理器由两个GPU组成一个单芯片，而Rubin Ultra则由四个GPU组成。
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