AI爆发,本土先进封装如何突破?

国际电子商情
22 Mar

AI芯片是半导体最大的增长点,先进封装则是制造AI芯片的关键技术。此前英伟达H100成本约3000美元,而用先进封装制造的HBM就值2000美元。曾经低调的后道技术,已经成为产业竞争的焦点。在重重制裁之下,中国先进封装如何匹配这波人工智能浪潮?2024年全球AI芯片市场规模突破 710亿美元,中国AI芯片市场约为250亿美元,全球占比约为 35.2%。2025年随着Deepseek落地,中国AI在...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10