行业要闻追踪:英伟达GTC 大会发布新芯片和CPO 交换机。3 月19 日,英伟达GTC 大会上发布了新芯片和CPO 交换机。1)B300 和Rubin:B300 基于全新Blackwell Ultra 架构,NVL72 机架下的GB300 比GB200 算力性能提升了150%。公司还展示了Rubin 新品,Vera Rubin 的整体性能是GB300 的3.3 倍。公司预计2028 年数据中心...
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