分析机构TechInsights报告显示,台积电美国亚利桑那州工厂的300mm晶圆加工成本比台湾工厂高出不到10%。尽管当地人力成本是台湾的3倍,但由于晶圆厂高度自动化,劳动力仅占总成本的2%,因此工资差异对整体成本影响有限。报告指出,半导体设备占晶圆加工成本的70%以上,而设备定价不受地域影响,这进一步缩小了成本差距。对于台积电在美首座晶圆厂,机构认为其50%的成本增幅符合新厂建设初期的常规经验...
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