【英伟达Rubin将采用台积电SoIC技术】金十数据3月25日讯,台积电在为2025年下半年2nm量产做准备的同时,也在加速先进封装扩张以满足强劲需求,并将重点转向CoWoS以外的领域。据悉,英伟达的下一代Rubin GPU将与AMD和苹果一起采用台积电的SoIC(集成芯片系统)技术。
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