0202 GMT - Kingboard Laminates stands to benefit from rising copper prices and growing printed-circuit-board demand from artificial-intelligence advancement, UOB Kay Hian analysts say in a research report. The company has established a laminate research & development center and has successfully developed a range of products and materials for AI servers and integrated-circuit substrates packaging, the analysts say. Its low-dielectric fiberglass yarn factory with annual capacity of 500 tons and its copper foil facility with monthly capacity of 1,500 tons are expected to start operations in 2025 to meet strong demand driven by AI advancement. The brokerage raises the stock's target price to HK$9.49 from HK$6.80 with an unchanged hold rating. Shares are 0.4% higher at HK$9.40. (ronnie.harui@wsj.com)
(END) Dow Jones Newswires
March 26, 2025 22:02 ET (02:02 GMT)
Copyright (c) 2025 Dow Jones & Company, Inc.
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.