科技媒体 SamMobile 昨日（3 月 25 日）发布博文，报道称高通对三星失去信心，即将推出的骁龙 8s Gen 4 芯片将由台积电独家代工，三星 4nm 工艺已出局。
IT之家此前报道，高通骁龙 8s Gen 4 芯片采用 X4+A720 全大核架构，包括 1 个 3.21GHz X4 + 3 个 3.01GHz A720 + 2 个 2.80GHz A720 + 2 个 2.02GHz A720 核心，搭配 Adreno 825 GPU，SLC 6MB，L3 8MB，安兔兔跑分 200W+。
三星于 2021 年年量产初代 4nm（SF4E），曾代工 Exynos 2200、谷歌 Tensor 等芯片，2023 年良率已追平台积电，最新第四代支持 2.5D / 3D 先进封装。
报道指出高通依然选择台积电的主要原因，是三星 3nm 工艺进展不顺引发连锁反应，导致客户信任度下滑，台积电成更稳妥选择。
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