据《日经新闻》报道,GlobalFoundries 和台湾芯片制造商联电正在酝酿潜在合并

路透中文
31 Mar
据《日经新闻》报道,GlobalFoundries 和台湾芯片制造商<a href="https://laohu8.com/S/UMC">联电</a>正在酝酿潜在合并

路透社3月31日 - 据《日经新闻》周一援引一份评估计划报道,台湾主要芯片制造商联华电子2303.TW和美国GlobalFoundriesGFS.O正在探讨合并的可能性。

(为便利非英文母语者,路透将其报导自动化翻译为数种其他语言。由于自动化翻译可能有误,或未能包含所需语境,路透不保证自动化翻译文本的准确性,仅是为了便利读者而提供自动化翻译。对于因为使用自动化翻译功能而造成的任何损害或损失,路透不承担任何责任。)

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