据报道，全球第三大晶圆代工厂格芯（GlobalFoundries）正在评估与中国台湾省半导体制造商联华电子（United Microelectronics， UMC）的合并可能性。

　　若交易达成，将创造一家年营收超过100亿美元的半导体制造巨头，显著改变当前台积电（TSMC）主导的晶圆代工市场格局。

　　分析师称，若合并成功，新实体将超越三星代工业务，成为仅次于台积电的全球第二大纯晶圆代工厂。

　　格芯在RF-SOI和FD-SOI特色工艺的优势与联电在成熟制程（28nm及以上）的产能形成协同。

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