BlockBeats 消息，4 月 1 日，日本政府支持的芯片企业 Rapidus 周二开始测试生产下一代芯片，这是日本自主制造人工智能组件早期的关键一步。Rapidus 准备在 2027 年采用 2 纳米工艺大规模生产半导体，理论上在芯片制造能力方面，它将与台积电匹敌。该公司 CEO 表示：“开发 2nm 技术和大规模生产非常困难，未来还有更多实验，我们将一步一步地降低错误率，获得客户的信任。”(金十)
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