联电新加坡Fab 12i晶圆厂将扩建,第一期2026年量产

爱集微
01 Apr

联电宣布在新加坡举行扩建新厂开幕典礼,新厂第一期将于2026年开始量产,预计将使联电新加坡Fab 12i晶圆厂总产能提升至每年超过100万片12英寸晶圆。联电这座新厂将成为新加坡最先进的半导体晶圆代工厂之一,提供用于通信、物联网、车用和人工智能(AI)创新领域的半导体芯片。联电位于新加坡白沙晶圆科技园区的全新扩建计划分为两期,第一期总投资金额50亿美元,月产能规划为3万片,并为未来投资计划预留...

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