智通财经APP获悉,据知情人士透露,软银(SFTBY.US)正在寻求一笔最高达165亿美元的贷款,用于资助其在美国的人工智能投资。这将是软银有史以来规模最大的单笔美元贷款。知情人士表示,正在讨论的过桥贷款期限约为12个月。知情人士还补充称,与银行的谈判尚处于早期阶段,细节可能在未来几周发生变化。
知情人士表示,这笔过桥贷款可能会帮助软银牵头的OpenAI新一轮400亿美元融资。根据研究公司PitchBook的数据,这将是OpenAI有史以来规模最大的一轮融资,其估值将达到3000亿美元,几乎是其去年10月融资时1570亿美元估值的两倍。
软银正在美国进行雄心勃勃的人工智能投资。今年1月,软银宣布将与OpenAI、甲骨文(ORCL.US)和阿布扎比支持的MGX公司合作名为“Stargate”(星际之门)的项目,在美国建造价值5000亿美元的数据中心和基础设施。上周有日媒报道称,软银正酝酿一项在全美建设集聚人工智能工厂的产业园区计划,可能承诺与美国政府共同投入超过1万亿美元。
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