日前,华为发布了阔折叠手机PuraX,引发行业热烈关注。而就在最近的拆解视频中显示,刚开卖的手机拆出来的芯片,比原来厚了一大截。华为Pura X搭载的麒麟9020芯片采用全新一体式封装工艺。拆解视频显示,麒麟9020封装方式从夹心饼结构转变为了SoC、DRAM一体化封装,暂时还不清楚是CoWoS还是InFO-PoP,亦或者其他封装形式。但无论如何,这又是国内先进封装能力的又一次展现。国内芯片设计厂...
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