据日经亚洲3月31日晚间报道,全球第五大晶圆代工厂格芯(GlobalFoundries)考虑与联电合并,成为全球第二大晶圆代工厂,以因应全球地缘政治变化日益紧张。日经报道称,两家公司有意创建一家规模更大的美国公司,将生产业务范围深入亚洲、美国和欧洲,借此确保美国能获得更多成熟制程芯片。日经报导指出,两家公司已就潜在合并事宜接触,美国和中国台湾的一些政府官员也知晓这一讨论。一位知情人士称,两家芯片...
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