【旷达科技:芯投微国内工厂投产后优化成本】金融界4月3日消息,旷达科技披露投资者关系活动记录表显示,芯投微在国内工厂投产后,通过4寸转6寸、设计更小的芯片、使用国产材料等方式综合降低成本;在技术方面,芯投微重点开发具有自主知识产权的TC-SAW和TF-SAW及更小尺寸的封装形式。

金融界
03 Apr
金融界4月3日消息,旷达科技披露投资者关系活动记录表显示,芯投微在国内工厂投产后,通过4寸转6寸、设计更小的芯片、使用国产材料等方式综合降低成本;在技术方面,芯投微重点开发具有自主知识产权的TC-SAW和TF-SAW及更小尺寸的封装形式。

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10