博通展示下一代AI集群的光互连解决方案

Ofweek维科网
03 Apr

当地时间3月31日,博通公司宣布扩展其光互连解决方案组合,以推动AI基础设施的发展。这些创新技术包括共封装光学(CPO)、200G/通道DSP和SerDes、400G光学以及PCIe Gen6光学互连,并将在2025年光纤通信大会暨展览会(OFC)上展示。博通的演示将重点展示公司迈向200T光互连解决方案的发展路线。随着AI工作负载的快速增长,对更高带宽、更低延迟和更高能效的光互连需求日益迫切。...

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