全球终端市场仍未全面复苏,半导体产业竞争态势日趋激烈,与此同时AI驱动半导体产业需求提升、技术升级,这一背景下,厂商正加速半导体先进制程与先进封装等技术突围。近期市场传出新进展:英特尔18A制程进入风险生产阶段;Rapidus计划推出2纳米芯片样品;三星加速推进2nm工艺研发;台积电先进制程、先进封装齐发力。01英特尔18A制程进入风险生产阶段在近期的Intel Vision 2025大会上,...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.