IBM与半导体设备巨头东京威力科创(TEL)近日共同宣布,将继续其合作协议,进行为期五年的先进半导体技术的联合研究和开发。这项新的协议将专注于推动下一代半导体节点和架构的技术发展,以满足生成式人工智能时代对效能的需求。此项协议建立在IBM与TEL长达二十多年的合作伙伴关系之上。过去,两家公司已取得多项突破性进展,包括为3D芯片堆叠技术开发出一种新型激光剥离制程,用于生产300mm硅晶圆。IBM...
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