据媒体周五报道，日本半导体新星企业Rapidus正与苹果、谷歌等数十家科技巨头展开谈判，计划在2027年实现2纳米及以下制程芯片的大规模量产。这一雄心勃勃的规划或将重塑全球芯片产业格局。

　　2025年，该公司基于IBM授权的2纳米GAA晶体管技术已建成试产线。

　　日本经济产业省已注资35亿美元，目标构建“去风险化”供应链。

　　除消费电子巨头外，该公司正与丰田等日系车企洽谈车载芯片定制。

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