金吾财讯 | 中信建投发研指，美国半导体企业占据中国市场较大市场份额，但中国直接从美国进口的产品较少，主要源于半导体产业链的全球化分工。NVIDIA、高通、AMD为代表的美国Fabless企业主导产品的设计与销售，其产品的晶圆制造大多位于台积电，封测环节则位于中国台湾等地。TI、Intel为代表的IDM企业，尽管其晶圆产能部分位于美国本土，但封装产能仍主要分布于东南亚地区。因此，若未来仍以成品封装地作为原产地依据，加征关税的实际影响或相对有限。但从长期来看，半导体领域的“去美化”趋势与国产化率提升的方向仍将持续。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.