当地时间4月14日,美国半导体设备大厂应用材料宣布,已收购了荷兰半导体设备厂商 BE Semiconductor Industries(简称“Besi”)9%的股份,超过了BESI原来的最大股东贝莱德的机构信托,成为了Besi 的最大股东。据了解,Besi 以生产精确的混合键合设备而闻名——这是先进半导体封装中的一项关键技术,能够使芯片直接堆叠在一起。与传统封装步骤不同,混合键合更接近半导体制造...
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