王化回应小米成立芯片平台部:一直存在 秦牧云已加入数年

快科技
16 Apr

快科技4月15日消息,今日新浪科技报道称,小米最新在手机部产品部组织架构下成立芯片平台部,任命秦牧云担任芯片平台部负责人,向产品部总经理李俊汇报。对此,王化发文回应称,手机产品部的芯片平台部一直存在,其部门工作主要是负责手机产品的芯片平台选型评估和深度定制。而负责人秦牧云加入公司都有好几年了,至少2021年就有小米办公的工作聊天记录了。据悉,秦牧云此前曾在高通任职,担任高通产品市场高级总监,后加入...

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