【台积电计划2027年量产面板级先进芯片封装】金十数据4月15日讯,台积电即将完成面板级先进芯片封装(PLP)的研发,并计划在2027年左右开始小批量生产。为满足对更强大的人工智能芯片的需求,面板级先进芯片封装将使用可容纳更多半导体的方形基板而非传统的圆形基板。
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