4月15日,多家媒体报道称,小米日前内部宣布,在手机部产品部组织架构下成立芯片平台部,任命秦牧云担任芯片平台部负责人,向产品部总经理李俊汇报。对于这一消息,小米集团公关部总经理王化发文回应称,“手机产品部的芯片平台部一直存在,其部门工作主要是负责手机产品的芯片平台选型评估和深度定制,而负责人秦牧云兄弟加入公司都有好几年了,至少我俩2021年就有小米办公的工作聊天记录了。”图源:社交媒体平台截图而...
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