据报小米(01810.HK)成立芯片平台部

阿斯达克财经
Yesterday

内媒《新浪科技》报道,小米(01810.HK) 日前内部宣布,在手机部产品部组织架构下成立芯片平台部,任命秦牧云担任芯片平台部负责人,向产品部总经理李俊汇报。资料显示,秦牧云此前曾在高通任职,担任高通产品市场高级总监,后加入小米。

报道指,近期有消息称,小米15S Pro将首发搭载小米自研SoC芯片登场。日前小米联合创始人、副董事长林斌亦在社交平台回复网友时首次确认小米15S Pro新机的存在。但新机的具体规格仍待确认。(ha/a)(港股报价延迟最少十五分钟。沽空资料截至 2025-04-15 16:25。)

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