应用材料(Applied Materials, Inc.)今日宣布,通过市场化交易收购半导体封装设备制造商Besi(BE Semiconductor Industries N.V)9 %的已发行普通股。此次战略投资无需监管审批,应用材料公司表示不寻求董事会席位或进一步增持股份。技术协同深化,瞄准下一代半导体封装自2020年建立合作关系以来,应用材料公司与Besi已联合开发基于芯片的混合键合(...
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