广东比亚迪节能科技申请MEMS器件及其封装方法专利,降低主体晶圆与衬底晶圆封装难度

金融界
16 Apr

金融界2025年4月16日消息,国家知识产权局信息显示,广东比亚迪节能科技有限公司申请一项名为“MEMS器件及其封装方法”的专利,公开号CN 119822314 A,申请日期为2024年9月。专利摘要显示,本公开涉及一种MEMS器件及其封装方法,MEMS器件包括主体晶圆(1)和衬底晶圆(2),所述主体晶圆(1)包括MEMS敏感结构(11)和第一导电层(12),所述MEMS敏感结构(11)包括多个...

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