在半导体产业日新月异的今天,制程技术的进步对于芯片制造商来说至关重要。Intel、台积电、三星等全球领先的半导体公司都在竞相推进其工艺制程技术,以在激烈的市场竞争中保持领先地位。其中,Intel的18A工艺制程技术已进入风险生产阶段,预计将采用PowerVia背面供电和RibbonFET栅极环绕(GAA)晶体管技术,成为其反超台积电、重夺半导体工艺世界第一的关键节点。本文将分析Intel、台积电、...
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