周一，美光科技(MU.US)涨逾5%，报73.63美元。消息面上，据报道，美光正加快采购韩国厂商韩美半导体的TC键合设备，以支持12Hi HBM3E扩展。数据显示，今年上半年美光对韩美半导体TC键合机的订单已超去年全年30至40台的规模。值得注意的是，目前唯有韩美半导体的设备能够满足12Hi TC键合需求，而日本新川SHINKAWA仅支持8Hi键合。

同时，另一家媒体透露，美光计划到今年底将HBM内存产量提升至每月6万片晶圆，这一水平接近行业龙头SK海力士的一半。此外，美光还将在2026年于新加坡、日本广岛及美国爱达荷州工厂启动HBM生产，并于2027年在美国纽约州增设产线，进一步巩固其在高端内存市场的地位。

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