三星4nm逻辑芯片良率超40% 助力12层HBM4研发

爱集微
18 Apr

三星代工工艺首次应用于作为第六代高带宽存储器(HBM4)大脑的“逻辑芯片”,据报道,三星电子代工部门生产的逻辑芯片测试良率稳定,这将为在HBM技术竞争中一直落后的三星电子对12层HBM4的开发和量产提供动力。据业内人士透露,采用三星电子代工4nm工艺生产的逻辑芯片的测试生产良率已超过40%。一位半导体业内人士解释道,“初始测试生产良率达到40%是一个不错的数字,我们可以立即开展业务”,并补充道,“...

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